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Effects of chemical mechanical...
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Effects of chemical mechanical polishing (CMP) parameters on NIP/AL substrate surface characteristics [electronic resource] /
Thesis (Sarjana Kejuruteraan (Kejuruteraan Industri)) - Universiti Teknologi Malaysia, 2014
Bibliographic Details
Main Author:
Mohd. Aidil Rosli, 1985-
Format:
Language:
eng
Published:
2014
Subjects:
Grinding and polishing
Chemical mechanical planarization
Holdings
Description
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