Optimal heat transfer of heat sink design based on electronic package thermal distribution using comsol package software [electronic resource] /
Thesis (Sarjana Kejuruteraan (Elektrik - Mekatronik dan Kawalan Automatik)) - Universiti Teknologi Malaysia, 2015
| Main Authors: | , , |
|---|---|
| Format: | |
| Language: | eng |
| Published: |
2015
|
| Subjects: |