Electroless nickel-phosphorus plating on copper plate by palladium activation technique /

Electroless nickel-phosphorus plating on copper plate by palladium activation technique /

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Project Paper (Sarjana Muda Sains (Kimia Industri)) - Universiti Teknologi Malaysia, 2018

Bibliographic Details
Main Authors: Aslinda Ramli, 1995-, author, Che Rozid Mamat, supervisor, Fakulti Sains
Format:
Language:eng
Published: Johor Bahru, Johor : Universiti Teknologi Malaysia, 2018
Subjects:
Electroless plating
Palladium

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