Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies /
Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges. Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 y...
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| Language: | eng |
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Hoboken, NJ, USA : John Wiley & Sons, Inc.,
2019
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