Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies /
Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges. Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 y...
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| Language: | eng |
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Hoboken, NJ, USA : John Wiley & Sons, Inc.,
2019
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| _version_ | 1796761416139538432 |
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| author | Keser, Beth, 1971-, editor Kroehnert, Steffen, 1970-, editor |
| author_facet | Keser, Beth, 1971-, editor Kroehnert, Steffen, 1970-, editor |
| author_sort | Keser, Beth, 1971-, editor |
| collection | OCEAN |
| description | Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges. Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. |
| first_indexed | 2024-03-05T16:25:50Z |
| format | |
| id | KOHA-OAI-TEST:558146 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| language | eng |
| last_indexed | 2024-03-05T16:25:50Z |
| publishDate | 2019 |
| publisher | Hoboken, NJ, USA : John Wiley & Sons, Inc., |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:5581462020-12-19T17:21:07ZAdvances in Embedded and Fan-Out Wafer-Level Packaging Technologies / Keser, Beth, 1971-, editor Kroehnert, Steffen, 1970-, editor Hoboken, NJ, USA : John Wiley & Sons, Inc.,♭20192019engExamines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges. Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons.Includes bibliographical references and index.Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges. Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons.PSZJBL Chip scale packaging Integrated circuitsURN:ISBN:9781119314134 |
| spellingShingle | Chip scale packaging Integrated circuits Keser, Beth, 1971-, editor Kroehnert, Steffen, 1970-, editor Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies / |
| title | Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies / |
| title_full | Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies / |
| title_fullStr | Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies / |
| title_full_unstemmed | Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies / |
| title_short | Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies / |
| title_sort | advances in embedded and fan out wafer level packaging technologies |
| topic | Chip scale packaging Integrated circuits |
| work_keys_str_mv | AT keserbeth1971editor advancesinembeddedandfanoutwaferlevelpackagingtechnologies AT kroehnertsteffen1970editor advancesinembeddedandfanoutwaferlevelpackagingtechnologies |