Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore /
Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and...
| Main Authors: | , , , , |
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| Format: | software, multimedia |
| Language: | eng |
| Published: |
Duxford : Woodhead Publishing,
2019
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| Subjects: | |
| Online Access: | https://www.sciencedirect.com/book/9780081025321 |