APA (7th ed.) Citation

Zhang, H., Che, F., Lin, T., Zhao, W., & 7722, S. (2019). Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore. Duxford : Woodhead Publishing.

Chicago Style (17th ed.) Citation

Zhang, Hengyun, Faxing Che, Tingyu Lin, Wensheng Zhao, and ScienceDirect 7722. Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore. Duxford : Woodhead Publishing, 2019.

MLA (9th ed.) Citation

Zhang, Hengyun, et al. Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore. Duxford : Woodhead Publishing, 2019.