Intermetallics in lead-free solder on direct immersion gold (dig) under bump metallurgy (UBM) [macrofilm] /

Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2003

Bibliographic Details
Main Author: 458460 Wong, Lee Kian
Format:
Language:eng
Published: Skudai : Universiti Teknologi Malaysia, 2003
Subjects: