Intermetallic Evolution for Isothermal Aging up to 2000 Hours on Sn-4Ag-0.5Cu and Sn-37Pb Solders with Ni/Au Layers
The reliability of a solder joint is closely related to the intermetallic compound formation during the joining process and its evolution after exposure to heat. Throughout this paper, interfacial reactions between Sn-4Ag-0.5Cu solders and Sn-37Pb solders with electroless nickel immersion gold (Ni/...
| Autori principali: | , , , |
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| Natura: | Articolo |
| Lingua: | English |
| Pubblicazione: |
Universiti Malaysia Pahang
2013
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| Soggetti: | |
| Accesso online: | http://umpir.ump.edu.my/id/eprint/10991/1/22_Azmah%20Hanim%20et%20al.pdf |