Effect of Immersion Coating Deposition Time on Solder Joint Properties
Surface finishes on copper pads have been known to be one of influential factor in the solder joint quality. This due to the difference in interfacial reaction and intermetallic compound formation on solder pad was strongly influence by the type of surface finishes. Deposition times during immersion...
| Główni autorzy: | , , , |
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| Format: | Artykuł |
| Język: | English |
| Wydane: |
Trans Tech Publications, Switzerland
2016
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| Hasła przedmiotowe: | |
| Dostęp online: | http://umpir.ump.edu.my/id/eprint/11693/1/Effect%20of%20Immersion%20Coating%20Deposition%20Time%20on%20Solder%20Joint%20Properties.pdf |