Thermal Cyclic Test For Sn-4Ag-0.5Cu Solders On High P Ni/Au AND Ni/Pd/Au Surface Finishes

Thermal Cyclic Test For Sn-4Ag-0.5Cu Solders On High P Ni/Au AND Ni/Pd/Au Surface Finishes

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In electronic packaging, the reliability of the interconnection changes with the surface finish and the type of solders being used. Thermal cycling is one method of reliability assessment. In thermal cycling experiments, the strain state is simplified by soldering together regular shaped pieces of m...

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Bibliographic Details
Main Authors: Azmah Hanim, Mohamad Ariff, Ourdjini, Ali, Siti Rabiatull Aisha, Idris, Saliza Azlina, Osman
Format: Conference or Workshop Item
Language:English
English
Published: 2015
Subjects:
TJ Mechanical engineering and machinery
Online Access:http://umpir.ump.edu.my/id/eprint/11780/1/Thermal%20Cyclic%20Test%20For%20Sn-4Ag-0.5Cu%20Solders%20On%20High%20P%20Ni-Au%20AND%20Ni-Pd-Au%20Surface%20Finishes.pdf
http://umpir.ump.edu.my/id/eprint/11780/7/Thermal%20Cyclic%20Test%20For%20Sn-4Ag-0.5Cu%20Solders%20On%20High%20P%20Ni-Au%20AND%20Ni-Pd-Au%20Surface%20Finishes-abstract.pdf

Internet

http://umpir.ump.edu.my/id/eprint/11780/1/Thermal%20Cyclic%20Test%20For%20Sn-4Ag-0.5Cu%20Solders%20On%20High%20P%20Ni-Au%20AND%20Ni-Pd-Au%20Surface%20Finishes.pdf
http://umpir.ump.edu.my/id/eprint/11780/7/Thermal%20Cyclic%20Test%20For%20Sn-4Ag-0.5Cu%20Solders%20On%20High%20P%20Ni-Au%20AND%20Ni-Pd-Au%20Surface%20Finishes-abstract.pdf

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