Development of Diffusion Barrier Layer on Copper-Printed Circuit Board Using Electroless Plating Method
In this paper, the nickel–phosphorus (Ni–P) diffusion barrier layer between Sn–4Ag–0.5Cu solder alloy and copper-printed circuit board was developed. The electroless plating technique was used to develop Ni–P diffusion barrier layer with different percentage of phosphorus content, which are 1–5 wt...
| Main Authors: | , , , |
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| 格式: | 文件 |
| 语言: | English English |
| 出版: |
Wessex Institute of Technology
2015
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| 主题: | |
| 在线阅读: | http://umpir.ump.edu.my/id/eprint/11846/1/CMEM030404f.pdf http://umpir.ump.edu.my/id/eprint/11846/7/fkm-2015-aisha-development%20of%20diffusion.pdf |