Intermetallic Growth and Shear Strength of SAC305/EN-Boron
The paper aimed to study the effect of aging and cooling rate on the reliability of the solder joint using electroless nickel boron (EN-Boron) as a surface finish in the electronic packaging area.EN-Boron was plated on Cu substrate through electroless plating method. This process was followed by ref...
| 主要な著者: | , , , |
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| フォーマット: | 論文 |
| 言語: | English English |
| 出版事項: |
Emerald Group Publishing Limited
2016
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| 主題: | |
| オンライン･アクセス: | http://umpir.ump.edu.my/id/eprint/13899/1/Intermetallic%20growth%20and%20shear%20strength%20of%20%20SAC305EN-Boron_wirda.pdf http://umpir.ump.edu.my/id/eprint/13899/7/fkm-2016-aisha-Intermetallic%20growth%20and%20shear%20strength1.pdf |