Effect of Flux onto Intermetallic Compound Formation and Growth

In this study, the effect of different composition of no-clean flux onto intermetallic compound (IMC) formation and growth was investigated. The solder joint between Sn 3Ag-0.5Cu solder alloy and printed circuit board (PCB) was made through reflow soldering. They were further aged at 125°C and 150°C...

وصف كامل

التفاصيل البيبلوغرافية
المؤلفون الرئيسيون: Siti Rabiatull Aisha, Idris, Noor, Farihan, Hardinnawirda, Kahar
التنسيق: Conference or Workshop Item
اللغة:English
منشور في: EDP Sciences 2016
الموضوعات:
الوصول للمادة أونلاين:http://umpir.ump.edu.my/id/eprint/14487/6/fkm-2016-aisha-effect%20of%20flux.pdf