The Effectiveness of Bismuth Addition to Retard the Intermetallic Compound Formation
The aim of this paper is to study the effectiveness of bismuth addition in the solder alloy to retard the intermetallic compound formation and growth. In this study, three categories of solders such as Sn-4Ag-xCu (x = 0.5, 0.7, 1.0) and Sn-4Ag-0.5Cu-xBi (x = 0.1, 0.2, 0.4) were used. Ni/Au surface f...
| Päätekijät: | , , |
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| Aineistotyyppi: | Artikkeli |
| Kieli: | English |
| Julkaistu: |
World Academy of Science, Engineering and Technology
2016
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| Aiheet: | |
| Linkit: | http://umpir.ump.edu.my/id/eprint/15813/1/The-Effectiveness-of-Bismuth.pdf |