Thermal Cyclic Test for Sn-4Ag-0.5Cu Solders on High P Ni/Au and Ni/Pd/Au Surface Finishes

In electronic packaging, the reliability of the interconnection changes with the surface finish and the type of solders being used. Thermal cycling is one method of reliability assessment. In thermal cycling experiments, the strain state is simplified by soldering together regular shaped pieces of m...

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Main Authors: Siti Rabiatull Aisha, Idris, Azmah Hanim, Mohamad Ariff, Ali, Ourdjini, Saliza Azlina, Osman
格式: 文件
语言:English
出版: Faculty Mechanical Engineering, UMP 2015
主题:
在线阅读:http://umpir.ump.edu.my/id/eprint/16200/1/IJCAT%2052%284%29%20Paper%206_2015_kak%20azmah.pdf