Thermal Cyclic Test for Sn-4Ag-0.5Cu Solders on High P Ni/Au and Ni/Pd/Au Surface Finishes

In electronic packaging, the reliability of the interconnection changes with the surface finish and the type of solders being used. Thermal cycling is one method of reliability assessment. In thermal cycling experiments, the strain state is simplified by soldering together regular shaped pieces of m...

पूर्ण विवरण

ग्रंथसूची विवरण
मुख्य लेखकों: Siti Rabiatull Aisha, Idris, Azmah Hanim, Mohamad Ariff, Ali, Ourdjini, Saliza Azlina, Osman
स्वरूप: लेख
भाषा:English
प्रकाशित: Faculty Mechanical Engineering, UMP 2015
विषय:
ऑनलाइन पहुंच:http://umpir.ump.edu.my/id/eprint/16200/1/IJCAT%2052%284%29%20Paper%206_2015_kak%20azmah.pdf