Fibre laser soldering operation and its effect onto intermetallic compound at the solder joint: short review

Nowadays the application of laser technology in microelectronic packaging has been widely implemented in many developed countries. Its flexibility on setting the parameters by following individual’s requirement, localized heating, non-contact heating, fast heating and cooling rate makes it one of th...

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书目详细资料
Main Authors: Nabila, Tamar Jaya, Siti Rabiatull Aisha, Idris
格式: Conference or Workshop Item
语言:English
English
出版: Universiti Malaysia Pahang 2019
主题:
在线阅读:http://umpir.ump.edu.my/id/eprint/27993/1/25.%20Fibre%20laser%20soldering%20operation%20and%20its%20effect.pdf
http://umpir.ump.edu.my/id/eprint/27993/2/25.1%20Fibre%20laser%20soldering%20operation%20and%20its%20effect.pdf