Effect of Different Nickel Percentage in Solder Alloy towards Intermetallic Compound Formation and Growth
The growth of electronics product has increased rapidly and hence drive challenges among the designers as well as manufacturers to select the best electronic packaging materials for their products. Among those materials, lead free solders has become the best replacement for lead-containing solders e...
| Main Authors: | , |
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| Format: | Conference or Workshop Item |
| Language: | English |
| Published: |
IOP Publishing
2021
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| Subjects: | |
| Online Access: | http://umpir.ump.edu.my/id/eprint/33589/7/Effect%20of%20Different%20Nickel%20Percentage%20in%20Solder.pdf |