Effect of Different Nickel Percentage in Solder Alloy towards Intermetallic Compound Formation and Growth

The growth of electronics product has increased rapidly and hence drive challenges among the designers as well as manufacturers to select the best electronic packaging materials for their products. Among those materials, lead free solders has become the best replacement for lead-containing solders e...

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书目详细资料
Main Authors: Muhammad Asyraf, Abdullah, Siti Rabiatull Aisha, Idris
格式: Conference or Workshop Item
语言:English
出版: IOP Publishing 2021
主题:
在线阅读:http://umpir.ump.edu.my/id/eprint/33589/7/Effect%20of%20Different%20Nickel%20Percentage%20in%20Solder.pdf