Study of underfill flow in microchip packaging using ansys
The project was related to microchip application where adhesive fluid is used to stick the microchip onto the electrical flat base. In this project, 5mm of width and length of microchip with 3 different types of solder ball diameter sizes are used in this project. The objective of the project is to...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
Penerbit UMP
2022
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| Subjects: | |
| Online Access: | http://umpir.ump.edu.my/id/eprint/35701/1/Study%20of%20Underfill%20Flow%20in%20Microchip%20PackagingUsing%20Ansys.pdf |