Effect of Multiple Reflow on Intermetallic Compound Formation using Various Surface Finishes
In this paper, the results of a study on the effect of multiple reflow on the mechanism of intermetallic compounds (IMC) formation of solder joints made from lead-free Sn-4Ag-0.5Cu (SAC405) on electroless nickel/electroless palladium/immersion gold (ENEPIG), electroless nickel/immersion gold (ENIG),...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Inderscience Enterprises Ltd.
2011
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| Subjects: | |
| Online Access: | http://umpir.ump.edu.my/id/eprint/5191/1/fkm-2011-rabiatull-EffectOfMultiple.pdf |