Effect of Nickel addition on Intermetallic Compound Properties of Sn-Cu Solder Alloy
The effect of nickel addition towards the intermetallic compound properties that formed between Sn-Cu solder alloy and Cu substrate were investigated in this study. Since the intermetallic compounds generally have brittle nature and its thick formation could lead to serious reliability concerns.Add...
| Những tác giả chính: | , , , |
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| Định dạng: | Conference or Workshop Item |
| Ngôn ngữ: | English |
| Được phát hành: |
2014
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| Những chủ đề: | |
| Truy cập trực tuyến: | http://umpir.ump.edu.my/id/eprint/6710/1/Effect_of_Nickel_addition_on_Intermetallic_Compound_Properties_of_Sn-Cu_Solder_Alloy.PDF |