Achieving high thermal conductivity of Al–50Si alloy through heat treatment and its microstructural evolution
Al–50Si alloys were prepared by powder extrusion and characterized for electronic packaging. The optimization of powder size, extrusion temperature, and heat treatment parameters was performed to enhance the microstructure and thermo-physical properties. The alloy exhibits a high relative density &g...
| Main Authors: | , , , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2023-11-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785423028120 |