Qubit-Compatible Substrates With Superconducting Through-Silicon Vias

Qubit-Compatible Substrates With Superconducting Through-Silicon Vias

We fabricate and characterize superconducting through-silicon vias and electrodes suitable for superconducting quantum processors. We measure internal quality factors of a million for test resonators excited at single-photon levels, on chips with superconducting vias used to stitch ground planes on...

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Bibliographic Details
Main Authors: K. Grigoras, N. Yurttagul, J.-P. Kaikkonen, E. T. Mannila, P. Eskelinen, D. P. Lozano, H.-X. Li, M. Rommel, D. Shiri, N. Tiencken, S. Simbierowicz, A. Ronzani, J. Hatinen, D. Datta, V. Vesterinen, L. Gronberg, J. Biznarova, A. Fadavi Roudsari, S. Kosen, A. Osman, M. Prunnila, J. Hassel, J. Bylander, J. Govenius
Format: Article
Language:English
Published: IEEE 2022-01-01
Series:IEEE Transactions on Quantum Engineering
Subjects:
High-Q resonator
quantum coherence
superconducting through-silicon via (TSV)
tantalum
titanium nitride
Online Access:https://ieeexplore.ieee.org/document/9903563/

Internet

https://ieeexplore.ieee.org/document/9903563/

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