Effect of trace elements on the interface reactions between two lead-free solders and copper or nickel substrates
Traditional Sn-Pb solder alloys are being replaced, because of environmental and health concerns about lead toxicity. Among some alternative alloy systems, the Sn-Zn and Sn-Cu base alloy systems have been studied and reveal promising properties. The reliability of a solder joint is affected by the s...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Technical Faculty, Bor
2007-01-01
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| Series: | Journal of Mining and Metallurgy. Section B: Metallurgy |
| Subjects: | |
| Online Access: | http://www.doiserbia.nb.rs/img/doi/1450-5339/2007/1450-53390702131S.pdf |