Preparation and Investigation of Micro-Transfer-Printable Single-Crystalline InP Coupons for Heterogeneous Integration of III-V on Si
New requirements for high-frequency applications in wireless communication and sensor technologies need III-V compound semiconductors such as indium phosphide (InP) to complement silicon (Si)-based technologies. This study establishes the basis for a new approach to heterogeneous integration of III-...
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MDPI AG
2023-07-01
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author | Isabella Peracchi Carsten Richter Tobias Schulz Jens Martin Albert Kwasniewski Sebastian Kläger Christiane Frank-Rotsch Patrick Steglich Karoline Stolze |
author_facet | Isabella Peracchi Carsten Richter Tobias Schulz Jens Martin Albert Kwasniewski Sebastian Kläger Christiane Frank-Rotsch Patrick Steglich Karoline Stolze |
author_sort | Isabella Peracchi |
collection | DOAJ |
description | New requirements for high-frequency applications in wireless communication and sensor technologies need III-V compound semiconductors such as indium phosphide (InP) to complement silicon (Si)-based technologies. This study establishes the basis for a new approach to heterogeneous integration of III-V on Si aimed at the transfer of single-crystalline InP coupons on Si via micro-transfer printing (μTP). The InP coupons will act as high-quality virtual substrates that allow selective homo-epitaxy. We present the chemical-mechanical polishing-based preparation and structural characterization of µm-thin (001) InP platelets, starting from high-quality 4-inch bulk crystals and micro-patterning into transferable coupons of several hundred µm<sup>2</sup>. The obtained InP platelets exhibit the desired thickness—below 10 ± 1 µm—and low surface roughness—<0.3 nm—on both sides, meeting the precondition for µTP and epitaxy. X-ray rocking curve measurements provide accurate spatial maps of the total strain, which indicate small strain variations in the µm-thin InP sample. Rocking curve mappings of the (0 0 4) reflection reveal half-widths below 16 arcsec in the majority of the sample area after thinning that is similar to commercially available InP bulk substrates. Pole figure measurements show no evidence of stress-induced micro-twinning or stacking faults. Overall, minor indications of crystal quality degradation in the product platelets, compared with the bulk samples, were detected. |
first_indexed | 2024-03-11T01:10:19Z |
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institution | Directory Open Access Journal |
issn | 2073-4352 |
language | English |
last_indexed | 2024-03-11T01:10:19Z |
publishDate | 2023-07-01 |
publisher | MDPI AG |
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series | Crystals |
spelling | doaj.art-02648caaee4f445f9062a500a377aaa62023-11-18T18:54:51ZengMDPI AGCrystals2073-43522023-07-01137112610.3390/cryst13071126Preparation and Investigation of Micro-Transfer-Printable Single-Crystalline InP Coupons for Heterogeneous Integration of III-V on SiIsabella Peracchi0Carsten Richter1Tobias Schulz2Jens Martin3Albert Kwasniewski4Sebastian Kläger5Christiane Frank-Rotsch6Patrick Steglich7Karoline Stolze8Leibniz-Institut für Kristallzüchtung (IKZ), 12489 Berlin, GermanyLeibniz-Institut für Kristallzüchtung (IKZ), 12489 Berlin, GermanyLeibniz-Institut für Kristallzüchtung (IKZ), 12489 Berlin, GermanyLeibniz-Institut für Kristallzüchtung (IKZ), 12489 Berlin, GermanyLeibniz-Institut für Kristallzüchtung (IKZ), 12489 Berlin, GermanyLeibniz-Institut für Kristallzüchtung (IKZ), 12489 Berlin, GermanyLeibniz-Institut für Kristallzüchtung (IKZ), 12489 Berlin, GermanyIHP—Leibniz-Institut für Innovative Mikroelektronik, 15236 Frankfurt (Oder), GermanyLeibniz-Institut für Kristallzüchtung (IKZ), 12489 Berlin, GermanyNew requirements for high-frequency applications in wireless communication and sensor technologies need III-V compound semiconductors such as indium phosphide (InP) to complement silicon (Si)-based technologies. This study establishes the basis for a new approach to heterogeneous integration of III-V on Si aimed at the transfer of single-crystalline InP coupons on Si via micro-transfer printing (μTP). The InP coupons will act as high-quality virtual substrates that allow selective homo-epitaxy. We present the chemical-mechanical polishing-based preparation and structural characterization of µm-thin (001) InP platelets, starting from high-quality 4-inch bulk crystals and micro-patterning into transferable coupons of several hundred µm<sup>2</sup>. The obtained InP platelets exhibit the desired thickness—below 10 ± 1 µm—and low surface roughness—<0.3 nm—on both sides, meeting the precondition for µTP and epitaxy. X-ray rocking curve measurements provide accurate spatial maps of the total strain, which indicate small strain variations in the µm-thin InP sample. Rocking curve mappings of the (0 0 4) reflection reveal half-widths below 16 arcsec in the majority of the sample area after thinning that is similar to commercially available InP bulk substrates. Pole figure measurements show no evidence of stress-induced micro-twinning or stacking faults. Overall, minor indications of crystal quality degradation in the product platelets, compared with the bulk samples, were detected.https://www.mdpi.com/2073-4352/13/7/1126indium phosphidecompound semiconductor crystalsIII-V on SiCMPX-ray diffractionrocking curve imaging |
spellingShingle | Isabella Peracchi Carsten Richter Tobias Schulz Jens Martin Albert Kwasniewski Sebastian Kläger Christiane Frank-Rotsch Patrick Steglich Karoline Stolze Preparation and Investigation of Micro-Transfer-Printable Single-Crystalline InP Coupons for Heterogeneous Integration of III-V on Si Crystals indium phosphide compound semiconductor crystals III-V on Si CMP X-ray diffraction rocking curve imaging |
title | Preparation and Investigation of Micro-Transfer-Printable Single-Crystalline InP Coupons for Heterogeneous Integration of III-V on Si |
title_full | Preparation and Investigation of Micro-Transfer-Printable Single-Crystalline InP Coupons for Heterogeneous Integration of III-V on Si |
title_fullStr | Preparation and Investigation of Micro-Transfer-Printable Single-Crystalline InP Coupons for Heterogeneous Integration of III-V on Si |
title_full_unstemmed | Preparation and Investigation of Micro-Transfer-Printable Single-Crystalline InP Coupons for Heterogeneous Integration of III-V on Si |
title_short | Preparation and Investigation of Micro-Transfer-Printable Single-Crystalline InP Coupons for Heterogeneous Integration of III-V on Si |
title_sort | preparation and investigation of micro transfer printable single crystalline inp coupons for heterogeneous integration of iii v on si |
topic | indium phosphide compound semiconductor crystals III-V on Si CMP X-ray diffraction rocking curve imaging |
url | https://www.mdpi.com/2073-4352/13/7/1126 |
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