Preparation and Investigation of Micro-Transfer-Printable Single-Crystalline InP Coupons for Heterogeneous Integration of III-V on Si

New requirements for high-frequency applications in wireless communication and sensor technologies need III-V compound semiconductors such as indium phosphide (InP) to complement silicon (Si)-based technologies. This study establishes the basis for a new approach to heterogeneous integration of III-...

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Main Authors: Isabella Peracchi, Carsten Richter, Tobias Schulz, Jens Martin, Albert Kwasniewski, Sebastian Kläger, Christiane Frank-Rotsch, Patrick Steglich, Karoline Stolze
Format: Article
Language:English
Published: MDPI AG 2023-07-01
Series:Crystals
Subjects:
Online Access:https://www.mdpi.com/2073-4352/13/7/1126
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author Isabella Peracchi
Carsten Richter
Tobias Schulz
Jens Martin
Albert Kwasniewski
Sebastian Kläger
Christiane Frank-Rotsch
Patrick Steglich
Karoline Stolze
author_facet Isabella Peracchi
Carsten Richter
Tobias Schulz
Jens Martin
Albert Kwasniewski
Sebastian Kläger
Christiane Frank-Rotsch
Patrick Steglich
Karoline Stolze
author_sort Isabella Peracchi
collection DOAJ
description New requirements for high-frequency applications in wireless communication and sensor technologies need III-V compound semiconductors such as indium phosphide (InP) to complement silicon (Si)-based technologies. This study establishes the basis for a new approach to heterogeneous integration of III-V on Si aimed at the transfer of single-crystalline InP coupons on Si via micro-transfer printing (μTP). The InP coupons will act as high-quality virtual substrates that allow selective homo-epitaxy. We present the chemical-mechanical polishing-based preparation and structural characterization of µm-thin (001) InP platelets, starting from high-quality 4-inch bulk crystals and micro-patterning into transferable coupons of several hundred µm<sup>2</sup>. The obtained InP platelets exhibit the desired thickness—below 10 ± 1 µm—and low surface roughness—<0.3 nm—on both sides, meeting the precondition for µTP and epitaxy. X-ray rocking curve measurements provide accurate spatial maps of the total strain, which indicate small strain variations in the µm-thin InP sample. Rocking curve mappings of the (0 0 4) reflection reveal half-widths below 16 arcsec in the majority of the sample area after thinning that is similar to commercially available InP bulk substrates. Pole figure measurements show no evidence of stress-induced micro-twinning or stacking faults. Overall, minor indications of crystal quality degradation in the product platelets, compared with the bulk samples, were detected.
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spelling doaj.art-02648caaee4f445f9062a500a377aaa62023-11-18T18:54:51ZengMDPI AGCrystals2073-43522023-07-01137112610.3390/cryst13071126Preparation and Investigation of Micro-Transfer-Printable Single-Crystalline InP Coupons for Heterogeneous Integration of III-V on SiIsabella Peracchi0Carsten Richter1Tobias Schulz2Jens Martin3Albert Kwasniewski4Sebastian Kläger5Christiane Frank-Rotsch6Patrick Steglich7Karoline Stolze8Leibniz-Institut für Kristallzüchtung (IKZ), 12489 Berlin, GermanyLeibniz-Institut für Kristallzüchtung (IKZ), 12489 Berlin, GermanyLeibniz-Institut für Kristallzüchtung (IKZ), 12489 Berlin, GermanyLeibniz-Institut für Kristallzüchtung (IKZ), 12489 Berlin, GermanyLeibniz-Institut für Kristallzüchtung (IKZ), 12489 Berlin, GermanyLeibniz-Institut für Kristallzüchtung (IKZ), 12489 Berlin, GermanyLeibniz-Institut für Kristallzüchtung (IKZ), 12489 Berlin, GermanyIHP—Leibniz-Institut für Innovative Mikroelektronik, 15236 Frankfurt (Oder), GermanyLeibniz-Institut für Kristallzüchtung (IKZ), 12489 Berlin, GermanyNew requirements for high-frequency applications in wireless communication and sensor technologies need III-V compound semiconductors such as indium phosphide (InP) to complement silicon (Si)-based technologies. This study establishes the basis for a new approach to heterogeneous integration of III-V on Si aimed at the transfer of single-crystalline InP coupons on Si via micro-transfer printing (μTP). The InP coupons will act as high-quality virtual substrates that allow selective homo-epitaxy. We present the chemical-mechanical polishing-based preparation and structural characterization of µm-thin (001) InP platelets, starting from high-quality 4-inch bulk crystals and micro-patterning into transferable coupons of several hundred µm<sup>2</sup>. The obtained InP platelets exhibit the desired thickness—below 10 ± 1 µm—and low surface roughness—<0.3 nm—on both sides, meeting the precondition for µTP and epitaxy. X-ray rocking curve measurements provide accurate spatial maps of the total strain, which indicate small strain variations in the µm-thin InP sample. Rocking curve mappings of the (0 0 4) reflection reveal half-widths below 16 arcsec in the majority of the sample area after thinning that is similar to commercially available InP bulk substrates. Pole figure measurements show no evidence of stress-induced micro-twinning or stacking faults. Overall, minor indications of crystal quality degradation in the product platelets, compared with the bulk samples, were detected.https://www.mdpi.com/2073-4352/13/7/1126indium phosphidecompound semiconductor crystalsIII-V on SiCMPX-ray diffractionrocking curve imaging
spellingShingle Isabella Peracchi
Carsten Richter
Tobias Schulz
Jens Martin
Albert Kwasniewski
Sebastian Kläger
Christiane Frank-Rotsch
Patrick Steglich
Karoline Stolze
Preparation and Investigation of Micro-Transfer-Printable Single-Crystalline InP Coupons for Heterogeneous Integration of III-V on Si
Crystals
indium phosphide
compound semiconductor crystals
III-V on Si
CMP
X-ray diffraction
rocking curve imaging
title Preparation and Investigation of Micro-Transfer-Printable Single-Crystalline InP Coupons for Heterogeneous Integration of III-V on Si
title_full Preparation and Investigation of Micro-Transfer-Printable Single-Crystalline InP Coupons for Heterogeneous Integration of III-V on Si
title_fullStr Preparation and Investigation of Micro-Transfer-Printable Single-Crystalline InP Coupons for Heterogeneous Integration of III-V on Si
title_full_unstemmed Preparation and Investigation of Micro-Transfer-Printable Single-Crystalline InP Coupons for Heterogeneous Integration of III-V on Si
title_short Preparation and Investigation of Micro-Transfer-Printable Single-Crystalline InP Coupons for Heterogeneous Integration of III-V on Si
title_sort preparation and investigation of micro transfer printable single crystalline inp coupons for heterogeneous integration of iii v on si
topic indium phosphide
compound semiconductor crystals
III-V on Si
CMP
X-ray diffraction
rocking curve imaging
url https://www.mdpi.com/2073-4352/13/7/1126
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