Process Optimization and Performance Evaluation of TSV Arrays for High Voltage Application

Process Optimization and Performance Evaluation of TSV Arrays for High Voltage Application

In order to obtain high-quality through-silicon via (TSV) arrays for high voltage applications, we optimized the fabrication processes of the Si holes, evaluated the dielectric layers, carried out hole filling by Cu plating, and detected the final structure and electric properties of the TSVs. The S...

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书目详细资料
Main Authors: Liuhaodong Feng, Shuwen Zeng, Yongquan Su, Lihao Wang, Yang Xu, Song Guo, Shuo Chen, Yucheng Ji, Xinlin Peng, Zhenyu Wu, Shinan Wang
格式: 文件
语言:English
出版: MDPI AG 2022-12-01
丛编:Micromachines
主题:
TSV
DRIE
hole sidewall smoothing
bottom-up electroplating
dielectric performance evaluation
在线阅读:https://www.mdpi.com/2072-666X/14/1/102

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https://www.mdpi.com/2072-666X/14/1/102

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