Strain Rate and Temperature Effects on Tensile Properties of Polycrystalline Cu<sub>6</sub>Sn<sub>5</sub> by Molecular Dynamic Simulation
Intermetallic compounds (IMCs) are essential in the soldering of electronic products and are composed mainly of Cu<sub>6</sub>Sn<sub>5</sub> and Cu<sub>3</sub>Sn. They must maintain reliable mechanical and electrical connections. As they are usually only a few mic...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2021-11-01
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| Series: | Crystals |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2073-4352/11/11/1415 |