| Summary: | Intermetallic compounds (IMCs) are essential in the soldering of electronic products and are composed mainly of Cu<sub>6</sub>Sn<sub>5</sub> and Cu<sub>3</sub>Sn. They must maintain reliable mechanical and electrical connections. As they are usually only a few microns thick, and it is difficult to study their mechanical properties by traditional methods. In this study, a 100 Å × 100 Å × 100 Å polycrystal with 10 grains was created by Atomsk through Voronoi tessellation based on a Cu<sub>6</sub>Sn<sub>5</sub> unit cell. The effects of the temperature and strain rate on the tensile properties of the polycrystalline Cu<sub>6</sub>Sn<sub>5</sub> were analyzed based on MEAM potential function using a molecular dynamics (MD) method. The results show that Young’s modulus and ultimate tensile strength (UTS) of the polycrystalline Cu<sub>6</sub>Sn<sub>5</sub> decrease approximately linearly with an increase in temperature. At high strain rates (0.001–100 ps<sup>−1</sup>), Young’s modulus and UTS of the Cu<sub>6</sub>Sn<sub>5</sub> are logarithmic with respect to the strain rate, and both increase with an increase in strain rate. In addition, at low strain rates (0.00001–0.0005 ps<sup>−1</sup>), the UTS has a quadratic increase as the strain rate increases.
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