Microstructure and failure mechanism of FGH96 solid-state diffusion bonding interface
The microstructure on the solid-state diffusion bonding interfaces of the initially as-forged, as-solution, and sub-aging FGH96 was characterized, the tensile properties of the bonding interfaces were tested, and the failure behavior was studied. It is found that the good metallurgical bonding is ac...
| Principais autores: | , , , , , |
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| Formato: | Artigo |
| Idioma: | zho |
| Publicado em: |
Editorial Office of Powder Metallurgy Technology
2021-08-01
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| coleção: | Fenmo yejin jishu |
| Assuntos: | |
| Acesso em linha: | https://pmt.ustb.edu.cn/article/doi/10.19591/j.cnki.cn11-1974/tf.2021040005 |