Microstructure and failure mechanism of FGH96 solid-state diffusion bonding interface
The microstructure on the solid-state diffusion bonding interfaces of the initially as-forged, as-solution, and sub-aging FGH96 was characterized, the tensile properties of the bonding interfaces were tested, and the failure behavior was studied. It is found that the good metallurgical bonding is ac...
| Main Authors: | , , , , , |
|---|---|
| Format: | Article |
| Language: | zho |
| Published: |
Editorial Office of Powder Metallurgy Technology
2021-08-01
|
| Series: | Fenmo yejin jishu |
| Subjects: | |
| Online Access: | https://pmt.ustb.edu.cn/article/doi/10.19591/j.cnki.cn11-1974/tf.2021040005 |