Numerical Evaluation on Residual Thermal Stress-Induced Delamination at PDMS–Metal Interface of Neural Prostheses
The most common failure mode of implantable neural implants has been delamination of layers in compound structures and encapsulations in a wet body environment. Current knowledge of failure mechanisms of adhesion and its standardized test procedures are lacking and must be established. This study de...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2021-06-01
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| Series: | Micromachines |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2072-666X/12/6/669 |