Numerical Evaluation on Residual Thermal Stress-Induced Delamination at PDMS–Metal Interface of Neural Prostheses

Numerical Evaluation on Residual Thermal Stress-Induced Delamination at PDMS–Metal Interface of Neural Prostheses

The most common failure mode of implantable neural implants has been delamination of layers in compound structures and encapsulations in a wet body environment. Current knowledge of failure mechanisms of adhesion and its standardized test procedures are lacking and must be established. This study de...

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Bibliographic Details
Main Authors: Yuyang Mao, Ivan Pechenizkiy, Thomas Stieglitz, Theodor Doll
Format: Article
Language:English
Published: MDPI AG 2021-06-01
Series:Micromachines
Subjects:
residual stresses
delamination
adhesion
polydimethylsiloxane-PDMS
shrinkage
neural electrodes
Online Access:https://www.mdpi.com/2072-666X/12/6/669

Internet

https://www.mdpi.com/2072-666X/12/6/669

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