Ultrasonic-assisted soldering of Mg alloy joints using Cu-foam/Sn composite solder foils
Mg alloys have been increasingly utilized in our daily life due to the low density and high specific strength and stiffness. However, the poor formability of these alloys restricted their adoption to some extent. The joining technique can effectively manufacture complex components, but some challeng...
| Main Authors: | , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2022-06-01
|
| Series: | Journal of Advanced Joining Processes |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2666330921000522 |