Self-Controlled Cleaving Method for Silicon DRIE Process Cross-Section Characterization

Self-Controlled Cleaving Method for Silicon DRIE Process Cross-Section Characterization

Advanced microsystems widely used in integrated optoelectronic devices, energy harvesting components, and microfluidic lab-on-chips require high-aspect silicon microstructures with a precisely controlled profile. Such microstructures can be fabricated using the Bosch process, which is a key process...

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Bibliographic Details
Main Authors: Dmitry A. Baklykov, Mihail Andronic, Olga S. Sorokina, Sergey S. Avdeev, Kirill A. Buzaverov, Ilya A. Ryzhikov, Ilya A. Rodionov
Format: Article
Language:English
Published: MDPI AG 2021-05-01
Series:Micromachines
Subjects:
Bosch process
DRIE of Silicon
MEMS
cross-section cleaving
Online Access:https://www.mdpi.com/2072-666X/12/5/534

Internet

https://www.mdpi.com/2072-666X/12/5/534

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