Structural Analysis of Power Devices and Assemblies by Thermal Transient Measurements

Structural Analysis of Power Devices and Assemblies by Thermal Transient Measurements

Power modules composed of semiconductor dice, thermal interface layers, and cooling mounts can be characterized by thermal transient testing at their actual position (in situ). This paper demonstrates that transient testing enables tracking of changes in material quality and structural details on th...

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Bibliographic Details
Main Authors: Gabor Farkas, Zoltan Sarkany, Marta Rencz
Format: Article
Language:English
Published: MDPI AG 2019-07-01
Series:Energies
Subjects:
thermal transient testing
non-destructive testing
thermal testability
in-situ characterization
Online Access:https://www.mdpi.com/1996-1073/12/14/2696

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https://www.mdpi.com/1996-1073/12/14/2696

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