Structural Analysis of Power Devices and Assemblies by Thermal Transient Measurements
Power modules composed of semiconductor dice, thermal interface layers, and cooling mounts can be characterized by thermal transient testing at their actual position (in situ). This paper demonstrates that transient testing enables tracking of changes in material quality and structural details on th...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2019-07-01
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| Series: | Energies |
| Subjects: | |
| Online Access: | https://www.mdpi.com/1996-1073/12/14/2696 |