Structural Analysis of Power Devices and Assemblies by Thermal Transient Measurements
Power modules composed of semiconductor dice, thermal interface layers, and cooling mounts can be characterized by thermal transient testing at their actual position (in situ). This paper demonstrates that transient testing enables tracking of changes in material quality and structural details on th...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
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MDPI AG
2019-07-01
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| Series: | Energies |
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| Online Access: | https://www.mdpi.com/1996-1073/12/14/2696 |
| _version_ | 1828233143559127040 |
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| author | Gabor Farkas Zoltan Sarkany Marta Rencz |
| author_facet | Gabor Farkas Zoltan Sarkany Marta Rencz |
| author_sort | Gabor Farkas |
| collection | DOAJ |
| description | Power modules composed of semiconductor dice, thermal interface layers, and cooling mounts can be characterized by thermal transient testing at their actual position (in situ). This paper demonstrates that transient testing enables tracking of changes in material quality and structural details on the raw heating or cooling curves. Higher precision can be achieved with the structure function technique where absolute and partial thermal resistance and capacitance values can be used for unambiguous identification of structural elements in a heat conducting path. Measurement techniques are presented to characterize the self-heating of a die and heat transfer between dice. Change of the thermal interface material layers in assembly during test sequences is also highlighted by the structure function concept. The power distribution between dice and wiring is analyzed by the newly introduced “accordion” principle. |
| first_indexed | 2024-04-12T19:34:49Z |
| format | Article |
| id | doaj.art-03e6a31fc52444ec9170250a2469aa8b |
| institution | Directory Open Access Journal |
| issn | 1996-1073 |
| language | English |
| last_indexed | 2024-04-12T19:34:49Z |
| publishDate | 2019-07-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Energies |
| spelling | doaj.art-03e6a31fc52444ec9170250a2469aa8b2022-12-22T03:19:15ZengMDPI AGEnergies1996-10732019-07-011214269610.3390/en12142696en12142696Structural Analysis of Power Devices and Assemblies by Thermal Transient MeasurementsGabor Farkas0Zoltan Sarkany1Marta Rencz2Mentor, a Siemens business, Mechanical Analysis Division, Gábor Dénes utca 2, 1117 Budapest, HungaryMentor, a Siemens business, Mechanical Analysis Division, Gábor Dénes utca 2, 1117 Budapest, HungaryMentor, a Siemens business, Mechanical Analysis Division, Gábor Dénes utca 2, 1117 Budapest, HungaryPower modules composed of semiconductor dice, thermal interface layers, and cooling mounts can be characterized by thermal transient testing at their actual position (in situ). This paper demonstrates that transient testing enables tracking of changes in material quality and structural details on the raw heating or cooling curves. Higher precision can be achieved with the structure function technique where absolute and partial thermal resistance and capacitance values can be used for unambiguous identification of structural elements in a heat conducting path. Measurement techniques are presented to characterize the self-heating of a die and heat transfer between dice. Change of the thermal interface material layers in assembly during test sequences is also highlighted by the structure function concept. The power distribution between dice and wiring is analyzed by the newly introduced “accordion” principle.https://www.mdpi.com/1996-1073/12/14/2696thermal transient testingnon-destructive testingthermal testabilityin-situ characterization |
| spellingShingle | Gabor Farkas Zoltan Sarkany Marta Rencz Structural Analysis of Power Devices and Assemblies by Thermal Transient Measurements Energies thermal transient testing non-destructive testing thermal testability in-situ characterization |
| title | Structural Analysis of Power Devices and Assemblies by Thermal Transient Measurements |
| title_full | Structural Analysis of Power Devices and Assemblies by Thermal Transient Measurements |
| title_fullStr | Structural Analysis of Power Devices and Assemblies by Thermal Transient Measurements |
| title_full_unstemmed | Structural Analysis of Power Devices and Assemblies by Thermal Transient Measurements |
| title_short | Structural Analysis of Power Devices and Assemblies by Thermal Transient Measurements |
| title_sort | structural analysis of power devices and assemblies by thermal transient measurements |
| topic | thermal transient testing non-destructive testing thermal testability in-situ characterization |
| url | https://www.mdpi.com/1996-1073/12/14/2696 |
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