Low-Temperature Sintering of Nanosilver Paste on a Gold Film Surface
Nanosilver paste with a low sintering temperature is a high-demand interconnection material for electronic devices and components due to its superior electrical, thermal, and thermomechanical properties, as well as the fact that it is lead free. This study presents a nanoscale silver paste that can...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
De Gruyter
2014-02-01
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| Series: | High Temperature Materials and Processes |
| Subjects: | |
| Online Access: | https://doi.org/10.1515/htmp-2013-0015 |