Low-Temperature Sintering of Nanosilver Paste on a Gold Film Surface
Nanosilver paste with a low sintering temperature is a high-demand interconnection material for electronic devices and components due to its superior electrical, thermal, and thermomechanical properties, as well as the fact that it is lead free. This study presents a nanoscale silver paste that can...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
De Gruyter
2014-02-01
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| Series: | High Temperature Materials and Processes |
| Subjects: | |
| Online Access: | https://doi.org/10.1515/htmp-2013-0015 |
| _version_ | 1819121956634492928 |
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| author | Luo Shiyong Zhang Xinlin Huang Xiaojun Xu Wencai |
| author_facet | Luo Shiyong Zhang Xinlin Huang Xiaojun Xu Wencai |
| author_sort | Luo Shiyong |
| collection | DOAJ |
| description | Nanosilver paste with a low sintering temperature is a high-demand interconnection material for electronic devices and components due to its superior electrical, thermal, and thermomechanical properties, as well as the fact that it is lead free. This study presents a nanoscale silver paste that can be sintered at 300 °C using 60-nm silver particles and an ethyl cellulose solution. The rheological and thixotropic behaviors of the typical paste were characterized, and the paste's screen printing ability was analyzed in detail. The paste demonstrates typical shear thinning rheological behavior and thixotropy of pseudoplastic fluids. Thermal characteristics of the 60 nm silver particles were measured by thermogravimetric analysis (TGA) and differential scanning calorimetry (DSC) to obtain a proper sintering temperature schedule. In this report, we also discussed the solid content, thermodynamic driving force for densification, and sintering process of the nanosilver particles. A 83 wt% of silver solid content at a heating rate of 20 °C/min was favorable for achieving a proper sintering densification. |
| first_indexed | 2024-12-22T06:44:48Z |
| format | Article |
| id | doaj.art-03f72a7875654627a05117422f1b2dc2 |
| institution | Directory Open Access Journal |
| issn | 0334-6455 2191-0324 |
| language | English |
| last_indexed | 2024-12-22T06:44:48Z |
| publishDate | 2014-02-01 |
| publisher | De Gruyter |
| record_format | Article |
| series | High Temperature Materials and Processes |
| spelling | doaj.art-03f72a7875654627a05117422f1b2dc22022-12-21T18:35:19ZengDe GruyterHigh Temperature Materials and Processes0334-64552191-03242014-02-01331212510.1515/htmp-2013-0015Low-Temperature Sintering of Nanosilver Paste on a Gold Film SurfaceLuo Shiyong0Zhang Xinlin1Huang Xiaojun2Xu Wencai3The Laboratory of Printing & Packaging Material and Technology, Beijing Institute of Graphic Communication, Beijing 102600, ChinaThe Laboratory of Printing & Packaging Material and Technology, Beijing Institute of Graphic Communication, Beijing 102600, ChinaThe Laboratory of Printing & Packaging Material and Technology, Beijing Institute of Graphic Communication, Beijing 102600, ChinaThe Laboratory of Printing & Packaging Material and Technology, Beijing Institute of Graphic Communication, Beijing 102600, ChinaNanosilver paste with a low sintering temperature is a high-demand interconnection material for electronic devices and components due to its superior electrical, thermal, and thermomechanical properties, as well as the fact that it is lead free. This study presents a nanoscale silver paste that can be sintered at 300 °C using 60-nm silver particles and an ethyl cellulose solution. The rheological and thixotropic behaviors of the typical paste were characterized, and the paste's screen printing ability was analyzed in detail. The paste demonstrates typical shear thinning rheological behavior and thixotropy of pseudoplastic fluids. Thermal characteristics of the 60 nm silver particles were measured by thermogravimetric analysis (TGA) and differential scanning calorimetry (DSC) to obtain a proper sintering temperature schedule. In this report, we also discussed the solid content, thermodynamic driving force for densification, and sintering process of the nanosilver particles. A 83 wt% of silver solid content at a heating rate of 20 °C/min was favorable for achieving a proper sintering densification.https://doi.org/10.1515/htmp-2013-0015nanosilver pastesintering of nano particlesrheological behaviorsolid contentlow sintering temperature |
| spellingShingle | Luo Shiyong Zhang Xinlin Huang Xiaojun Xu Wencai Low-Temperature Sintering of Nanosilver Paste on a Gold Film Surface High Temperature Materials and Processes nanosilver paste sintering of nano particles rheological behavior solid content low sintering temperature |
| title | Low-Temperature Sintering of Nanosilver Paste on a Gold Film Surface |
| title_full | Low-Temperature Sintering of Nanosilver Paste on a Gold Film Surface |
| title_fullStr | Low-Temperature Sintering of Nanosilver Paste on a Gold Film Surface |
| title_full_unstemmed | Low-Temperature Sintering of Nanosilver Paste on a Gold Film Surface |
| title_short | Low-Temperature Sintering of Nanosilver Paste on a Gold Film Surface |
| title_sort | low temperature sintering of nanosilver paste on a gold film surface |
| topic | nanosilver paste sintering of nano particles rheological behavior solid content low sintering temperature |
| url | https://doi.org/10.1515/htmp-2013-0015 |
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