Creep-fatigue life evaluation of Sn-3.5Ag lead-free solder at low temperatures
This paper describes creep-fatigue lives of Sn-3.5Ag lead-free solder at low temperatures. Since solders have lower melting temperature and electronic devices are often used at low temperature environment, it is effective for improving the fatigue life evaluating precision of solder joints to make c...
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| Format: | Article |
| Language: | English |
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The Japan Society of Mechanical Engineers
2016-05-01
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| Series: | Mechanical Engineering Journal |
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| Online Access: | https://www.jstage.jst.go.jp/article/mej/3/3/3_16-00081/_pdf/-char/en |