Fabrication of high aspect ratio, non-line-of-sight vias in silicon carbide by a two-photon absorption method
Abstract The future of Moore’s Law for high-performance integrated circuits (ICs) is going to be driven more by advanced packaging and three-dimensional (3D) integration than by simply decreasing transistor size. 3D ICs offer low-power consumption, high-performance and a smaller footprint compared t...
| Main Authors: | , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Nature Portfolio
2024-01-01
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| Series: | Scientific Reports |
| Online Access: | https://doi.org/10.1038/s41598-024-52672-6 |