Study of Through Glass Via (TGV) Using Bessel Beam, Ultrashort Two-Pulses of Laser and Selective Chemical Etching

Study of Through Glass Via (TGV) Using Bessel Beam, Ultrashort Two-Pulses of Laser and Selective Chemical Etching

Selective laser etching is a promising candidate for the mass production of glass interposers. It comprises two steps: local modification by an ultrashort-pulsed laser and chemical etching of the modified volume. According to previous studies, when an ultrashort-pulsed laser beam is irradiated on th...

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Bibliographic Details
Main Authors: Jonghyeok Kim, Sungil Kim, Byungjoo Kim, Jiyeon Choi, Sanghoon Ahn
Format: Article
Language:English
Published: MDPI AG 2023-09-01
Series:Micromachines
Subjects:
selective laser-induced etching
burst-mode laser
spatial light modulator
Bessel beam
ultrashort pulsed laser
Online Access:https://www.mdpi.com/2072-666X/14/9/1766

Internet

https://www.mdpi.com/2072-666X/14/9/1766

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