Study of Through Glass Via (TGV) Using Bessel Beam, Ultrashort Two-Pulses of Laser and Selective Chemical Etching

Selective laser etching is a promising candidate for the mass production of glass interposers. It comprises two steps: local modification by an ultrashort-pulsed laser and chemical etching of the modified volume. According to previous studies, when an ultrashort-pulsed laser beam is irradiated on th...

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Main Authors: Jonghyeok Kim, Sungil Kim, Byungjoo Kim, Jiyeon Choi, Sanghoon Ahn
Format: Article
Language:English
Published: MDPI AG 2023-09-01
Series:Micromachines
Subjects:
Online Access:https://www.mdpi.com/2072-666X/14/9/1766
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author Jonghyeok Kim
Sungil Kim
Byungjoo Kim
Jiyeon Choi
Sanghoon Ahn
author_facet Jonghyeok Kim
Sungil Kim
Byungjoo Kim
Jiyeon Choi
Sanghoon Ahn
author_sort Jonghyeok Kim
collection DOAJ
description Selective laser etching is a promising candidate for the mass production of glass interposers. It comprises two steps: local modification by an ultrashort-pulsed laser and chemical etching of the modified volume. According to previous studies, when an ultrashort-pulsed laser beam is irradiated on the sample, electron excitation occurs, followed by phonon vibration. In general, the electron excitation occurs for less than a few tens of picoseconds and phonon vibration occurs for more than 100 picoseconds. Thus, in order to compare the electric absorption and thermal absorption of photons in the commercial glass, we attempt to implement an additional laser pulse of 213 ps and 10 ns after the first pulse. The modified glass sample is etched with 8 mol/L KOH solution with 110 °C to verify the effect. Here, we found that the electric absorption of photons is more effective than the thermal absorption of them. We can claim that this result helps to enhance the process speed of TGV generation.
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spelling doaj.art-0467074fd6404cce82d9552d683bcbb12023-11-19T12:00:20ZengMDPI AGMicromachines2072-666X2023-09-01149176610.3390/mi14091766Study of Through Glass Via (TGV) Using Bessel Beam, Ultrashort Two-Pulses of Laser and Selective Chemical EtchingJonghyeok Kim0Sungil Kim1Byungjoo Kim2Jiyeon Choi3Sanghoon Ahn4Department of Laser & Electron Beam Technologies, Korea Institute of Machinery & Materials, 156 Gajeongbuk-Ro, Yuseong-Gu, Daejeon 34103, Republic of KoreaDepartment of Laser & Electron Beam Technologies, Korea Institute of Machinery & Materials, 156 Gajeongbuk-Ro, Yuseong-Gu, Daejeon 34103, Republic of KoreaDepartment of Laser & Electron Beam Technologies, Korea Institute of Machinery & Materials, 156 Gajeongbuk-Ro, Yuseong-Gu, Daejeon 34103, Republic of KoreaDepartment of Laser & Electron Beam Technologies, Korea Institute of Machinery & Materials, 156 Gajeongbuk-Ro, Yuseong-Gu, Daejeon 34103, Republic of KoreaDepartment of Laser & Electron Beam Technologies, Korea Institute of Machinery & Materials, 156 Gajeongbuk-Ro, Yuseong-Gu, Daejeon 34103, Republic of KoreaSelective laser etching is a promising candidate for the mass production of glass interposers. It comprises two steps: local modification by an ultrashort-pulsed laser and chemical etching of the modified volume. According to previous studies, when an ultrashort-pulsed laser beam is irradiated on the sample, electron excitation occurs, followed by phonon vibration. In general, the electron excitation occurs for less than a few tens of picoseconds and phonon vibration occurs for more than 100 picoseconds. Thus, in order to compare the electric absorption and thermal absorption of photons in the commercial glass, we attempt to implement an additional laser pulse of 213 ps and 10 ns after the first pulse. The modified glass sample is etched with 8 mol/L KOH solution with 110 °C to verify the effect. Here, we found that the electric absorption of photons is more effective than the thermal absorption of them. We can claim that this result helps to enhance the process speed of TGV generation.https://www.mdpi.com/2072-666X/14/9/1766selective laser-induced etchingburst-mode laserspatial light modulatorBessel beamultrashort pulsed laser
spellingShingle Jonghyeok Kim
Sungil Kim
Byungjoo Kim
Jiyeon Choi
Sanghoon Ahn
Study of Through Glass Via (TGV) Using Bessel Beam, Ultrashort Two-Pulses of Laser and Selective Chemical Etching
Micromachines
selective laser-induced etching
burst-mode laser
spatial light modulator
Bessel beam
ultrashort pulsed laser
title Study of Through Glass Via (TGV) Using Bessel Beam, Ultrashort Two-Pulses of Laser and Selective Chemical Etching
title_full Study of Through Glass Via (TGV) Using Bessel Beam, Ultrashort Two-Pulses of Laser and Selective Chemical Etching
title_fullStr Study of Through Glass Via (TGV) Using Bessel Beam, Ultrashort Two-Pulses of Laser and Selective Chemical Etching
title_full_unstemmed Study of Through Glass Via (TGV) Using Bessel Beam, Ultrashort Two-Pulses of Laser and Selective Chemical Etching
title_short Study of Through Glass Via (TGV) Using Bessel Beam, Ultrashort Two-Pulses of Laser and Selective Chemical Etching
title_sort study of through glass via tgv using bessel beam ultrashort two pulses of laser and selective chemical etching
topic selective laser-induced etching
burst-mode laser
spatial light modulator
Bessel beam
ultrashort pulsed laser
url https://www.mdpi.com/2072-666X/14/9/1766
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