Study of Through Glass Via (TGV) Using Bessel Beam, Ultrashort Two-Pulses of Laser and Selective Chemical Etching
Selective laser etching is a promising candidate for the mass production of glass interposers. It comprises two steps: local modification by an ultrashort-pulsed laser and chemical etching of the modified volume. According to previous studies, when an ultrashort-pulsed laser beam is irradiated on th...
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MDPI AG
2023-09-01
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Online Access: | https://www.mdpi.com/2072-666X/14/9/1766 |
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author | Jonghyeok Kim Sungil Kim Byungjoo Kim Jiyeon Choi Sanghoon Ahn |
author_facet | Jonghyeok Kim Sungil Kim Byungjoo Kim Jiyeon Choi Sanghoon Ahn |
author_sort | Jonghyeok Kim |
collection | DOAJ |
description | Selective laser etching is a promising candidate for the mass production of glass interposers. It comprises two steps: local modification by an ultrashort-pulsed laser and chemical etching of the modified volume. According to previous studies, when an ultrashort-pulsed laser beam is irradiated on the sample, electron excitation occurs, followed by phonon vibration. In general, the electron excitation occurs for less than a few tens of picoseconds and phonon vibration occurs for more than 100 picoseconds. Thus, in order to compare the electric absorption and thermal absorption of photons in the commercial glass, we attempt to implement an additional laser pulse of 213 ps and 10 ns after the first pulse. The modified glass sample is etched with 8 mol/L KOH solution with 110 °C to verify the effect. Here, we found that the electric absorption of photons is more effective than the thermal absorption of them. We can claim that this result helps to enhance the process speed of TGV generation. |
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language | English |
last_indexed | 2024-03-10T22:26:41Z |
publishDate | 2023-09-01 |
publisher | MDPI AG |
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series | Micromachines |
spelling | doaj.art-0467074fd6404cce82d9552d683bcbb12023-11-19T12:00:20ZengMDPI AGMicromachines2072-666X2023-09-01149176610.3390/mi14091766Study of Through Glass Via (TGV) Using Bessel Beam, Ultrashort Two-Pulses of Laser and Selective Chemical EtchingJonghyeok Kim0Sungil Kim1Byungjoo Kim2Jiyeon Choi3Sanghoon Ahn4Department of Laser & Electron Beam Technologies, Korea Institute of Machinery & Materials, 156 Gajeongbuk-Ro, Yuseong-Gu, Daejeon 34103, Republic of KoreaDepartment of Laser & Electron Beam Technologies, Korea Institute of Machinery & Materials, 156 Gajeongbuk-Ro, Yuseong-Gu, Daejeon 34103, Republic of KoreaDepartment of Laser & Electron Beam Technologies, Korea Institute of Machinery & Materials, 156 Gajeongbuk-Ro, Yuseong-Gu, Daejeon 34103, Republic of KoreaDepartment of Laser & Electron Beam Technologies, Korea Institute of Machinery & Materials, 156 Gajeongbuk-Ro, Yuseong-Gu, Daejeon 34103, Republic of KoreaDepartment of Laser & Electron Beam Technologies, Korea Institute of Machinery & Materials, 156 Gajeongbuk-Ro, Yuseong-Gu, Daejeon 34103, Republic of KoreaSelective laser etching is a promising candidate for the mass production of glass interposers. It comprises two steps: local modification by an ultrashort-pulsed laser and chemical etching of the modified volume. According to previous studies, when an ultrashort-pulsed laser beam is irradiated on the sample, electron excitation occurs, followed by phonon vibration. In general, the electron excitation occurs for less than a few tens of picoseconds and phonon vibration occurs for more than 100 picoseconds. Thus, in order to compare the electric absorption and thermal absorption of photons in the commercial glass, we attempt to implement an additional laser pulse of 213 ps and 10 ns after the first pulse. The modified glass sample is etched with 8 mol/L KOH solution with 110 °C to verify the effect. Here, we found that the electric absorption of photons is more effective than the thermal absorption of them. We can claim that this result helps to enhance the process speed of TGV generation.https://www.mdpi.com/2072-666X/14/9/1766selective laser-induced etchingburst-mode laserspatial light modulatorBessel beamultrashort pulsed laser |
spellingShingle | Jonghyeok Kim Sungil Kim Byungjoo Kim Jiyeon Choi Sanghoon Ahn Study of Through Glass Via (TGV) Using Bessel Beam, Ultrashort Two-Pulses of Laser and Selective Chemical Etching Micromachines selective laser-induced etching burst-mode laser spatial light modulator Bessel beam ultrashort pulsed laser |
title | Study of Through Glass Via (TGV) Using Bessel Beam, Ultrashort Two-Pulses of Laser and Selective Chemical Etching |
title_full | Study of Through Glass Via (TGV) Using Bessel Beam, Ultrashort Two-Pulses of Laser and Selective Chemical Etching |
title_fullStr | Study of Through Glass Via (TGV) Using Bessel Beam, Ultrashort Two-Pulses of Laser and Selective Chemical Etching |
title_full_unstemmed | Study of Through Glass Via (TGV) Using Bessel Beam, Ultrashort Two-Pulses of Laser and Selective Chemical Etching |
title_short | Study of Through Glass Via (TGV) Using Bessel Beam, Ultrashort Two-Pulses of Laser and Selective Chemical Etching |
title_sort | study of through glass via tgv using bessel beam ultrashort two pulses of laser and selective chemical etching |
topic | selective laser-induced etching burst-mode laser spatial light modulator Bessel beam ultrashort pulsed laser |
url | https://www.mdpi.com/2072-666X/14/9/1766 |
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