Study of Through Glass Via (TGV) Using Bessel Beam, Ultrashort Two-Pulses of Laser and Selective Chemical Etching
Selective laser etching is a promising candidate for the mass production of glass interposers. It comprises two steps: local modification by an ultrashort-pulsed laser and chemical etching of the modified volume. According to previous studies, when an ultrashort-pulsed laser beam is irradiated on th...
Main Authors: | Jonghyeok Kim, Sungil Kim, Byungjoo Kim, Jiyeon Choi, Sanghoon Ahn |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2023-09-01
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Series: | Micromachines |
Subjects: | |
Online Access: | https://www.mdpi.com/2072-666X/14/9/1766 |
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