Mold Fungal Resistance of Loose-Fill Thermal Insulation Materials Based on Processed Wheat Straw, Corn Stalk and Reed

Mold Fungal Resistance of Loose-Fill Thermal Insulation Materials Based on Processed Wheat Straw, Corn Stalk and Reed

The present study evaluates the mold fungal resistance of newly developed loose-fill thermal insulation materials made of wheat straw, corn stalk and water reed. Three distinct techniques for the processing of raw materials were used: mechanical crushing (Raw, ≤20 mm), thermo-mechanical pulping (TMP...

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Bibliographic Details
Main Authors: Ramunas Tupciauskas, Zigmunds Orlovskis, Karlis Trevors Blums, Janis Liepins, Andris Berzins, Gunars Pavlovics, Martins Andzs
Format: Article
Language:English
Published: MDPI AG 2024-02-01
Series:Polymers
Subjects:
wheat straw
reed
corn stalk
steam-exploded pulp
thermo-mechanical pulp
lignocellulosic biomass
Online Access:https://www.mdpi.com/2073-4360/16/4/562

Internet

https://www.mdpi.com/2073-4360/16/4/562

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