Characteristics of Cracking Failure in Microbump Joints for 3D Chip-on-Chip Interconnections under Drop Impact
With the rapid development of microelectronics packaging and integration, the failure risk of micro-solder joints in packaging structure caused by impact load has been increasingly concerning. However, the failure mechanism and reliability performance of a Cu-pillar-based microbump joint can use lit...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2022-02-01
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| Series: | Micromachines |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2072-666X/13/2/281 |