Suppression of the Growth of Intermetallic Compound Layers with the Addition of Graphene Nano-Sheets to an Epoxy Sn–Ag–Cu Solder on a Cu Substrate
This study investigated the suppression of the growth of the intermetallic compound (IMC) layer that forms between epoxy solder joints and the substrate in electronic packaging by adding graphene nano-sheets (GNSs) to 96.5Sn–3.0Ag–0.5Cu (wt %, SAC305) solder whose bonding charact...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2019-03-01
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| Series: | Materials |
| Subjects: | |
| Online Access: | https://www.mdpi.com/1996-1944/12/6/936 |