Suppression of the Growth of Intermetallic Compound Layers with the Addition of Graphene Nano-Sheets to an Epoxy Sn–Ag–Cu Solder on a Cu Substrate
This study investigated the suppression of the growth of the intermetallic compound (IMC) layer that forms between epoxy solder joints and the substrate in electronic packaging by adding graphene nano-sheets (GNSs) to 96.5Sn–3.0Ag–0.5Cu (wt %, SAC305) solder whose bonding charact...
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MDPI AG
2019-03-01
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| Online Access: | https://www.mdpi.com/1996-1944/12/6/936 |
| _version_ | 1811200213728100352 |
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| author | Min-Soo Kang Do-Seok Kim Young-Eui Shin |
| author_facet | Min-Soo Kang Do-Seok Kim Young-Eui Shin |
| author_sort | Min-Soo Kang |
| collection | DOAJ |
| description | This study investigated the suppression of the growth of the intermetallic compound (IMC) layer that forms between epoxy solder joints and the substrate in electronic packaging by adding graphene nano-sheets (GNSs) to 96.5Sn–3.0Ag–0.5Cu (wt %, SAC305) solder whose bonding characteristics had been strengthened with a polymer. IMC growth was induced in isothermal aging tests at 150 °C, 125 °C and 85 °C for 504 h (21 days). Activation energies were calculated based on the IMC layer thickness, temperature, and time. The activation energy required for the formation of IMCs was 45.5 KJ/mol for the plain epoxy solder, 52.8 KJ/mol for the 0.01%-GNS solder, 62.5 KJ/mol for the 0.05%-GNS solder, and 68.7 KJ/mol for the 0.1%-GNS solder. Thus, the preventive effects were higher for increasing concentrations of GNS in the epoxy solder. In addition, shear tests were employed on the solder joints to analyze the relationship between the addition of GNSs and the bonding characteristics of the solder joints. It was found that the addition of GNSs to epoxy solder weakened the bonding characteristics of the solder, but not critically so because the shear force was higher than for normal solder (i.e., without the addition of epoxy). Thus, the addition of a small amount of GNSs to epoxy solder can suppress the formation of an IMC layer during isothermal aging without significantly weakening the bonding characteristics of the epoxy solder paste. |
| first_indexed | 2024-04-12T02:00:56Z |
| format | Article |
| id | doaj.art-04c481554f8d4b0c8f0da48c7c210224 |
| institution | Directory Open Access Journal |
| issn | 1996-1944 |
| language | English |
| last_indexed | 2024-04-12T02:00:56Z |
| publishDate | 2019-03-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Materials |
| spelling | doaj.art-04c481554f8d4b0c8f0da48c7c2102242022-12-22T03:52:40ZengMDPI AGMaterials1996-19442019-03-0112693610.3390/ma12060936ma12060936Suppression of the Growth of Intermetallic Compound Layers with the Addition of Graphene Nano-Sheets to an Epoxy Sn–Ag–Cu Solder on a Cu SubstrateMin-Soo Kang0Do-Seok Kim1Young-Eui Shin2School of Mechanical Engineering, Chung-Ang University, 84, Heukseok-ro, Dongjak-gu, Seoul 06974, KoreaSchool of Mechanical Engineering, Chung-Ang University, 84, Heukseok-ro, Dongjak-gu, Seoul 06974, KoreaSchool of Mechanical Engineering, Chung-Ang University, 84, Heukseok-ro, Dongjak-gu, Seoul 06974, KoreaThis study investigated the suppression of the growth of the intermetallic compound (IMC) layer that forms between epoxy solder joints and the substrate in electronic packaging by adding graphene nano-sheets (GNSs) to 96.5Sn–3.0Ag–0.5Cu (wt %, SAC305) solder whose bonding characteristics had been strengthened with a polymer. IMC growth was induced in isothermal aging tests at 150 °C, 125 °C and 85 °C for 504 h (21 days). Activation energies were calculated based on the IMC layer thickness, temperature, and time. The activation energy required for the formation of IMCs was 45.5 KJ/mol for the plain epoxy solder, 52.8 KJ/mol for the 0.01%-GNS solder, 62.5 KJ/mol for the 0.05%-GNS solder, and 68.7 KJ/mol for the 0.1%-GNS solder. Thus, the preventive effects were higher for increasing concentrations of GNS in the epoxy solder. In addition, shear tests were employed on the solder joints to analyze the relationship between the addition of GNSs and the bonding characteristics of the solder joints. It was found that the addition of GNSs to epoxy solder weakened the bonding characteristics of the solder, but not critically so because the shear force was higher than for normal solder (i.e., without the addition of epoxy). Thus, the addition of a small amount of GNSs to epoxy solder can suppress the formation of an IMC layer during isothermal aging without significantly weakening the bonding characteristics of the epoxy solder paste.https://www.mdpi.com/1996-1944/12/6/936graphene nano-sheets (GNSs)epoxy solderintermetallic compound (IMC) |
| spellingShingle | Min-Soo Kang Do-Seok Kim Young-Eui Shin Suppression of the Growth of Intermetallic Compound Layers with the Addition of Graphene Nano-Sheets to an Epoxy Sn–Ag–Cu Solder on a Cu Substrate Materials graphene nano-sheets (GNSs) epoxy solder intermetallic compound (IMC) |
| title | Suppression of the Growth of Intermetallic Compound Layers with the Addition of Graphene Nano-Sheets to an Epoxy Sn–Ag–Cu Solder on a Cu Substrate |
| title_full | Suppression of the Growth of Intermetallic Compound Layers with the Addition of Graphene Nano-Sheets to an Epoxy Sn–Ag–Cu Solder on a Cu Substrate |
| title_fullStr | Suppression of the Growth of Intermetallic Compound Layers with the Addition of Graphene Nano-Sheets to an Epoxy Sn–Ag–Cu Solder on a Cu Substrate |
| title_full_unstemmed | Suppression of the Growth of Intermetallic Compound Layers with the Addition of Graphene Nano-Sheets to an Epoxy Sn–Ag–Cu Solder on a Cu Substrate |
| title_short | Suppression of the Growth of Intermetallic Compound Layers with the Addition of Graphene Nano-Sheets to an Epoxy Sn–Ag–Cu Solder on a Cu Substrate |
| title_sort | suppression of the growth of intermetallic compound layers with the addition of graphene nano sheets to an epoxy sn ag cu solder on a cu substrate |
| topic | graphene nano-sheets (GNSs) epoxy solder intermetallic compound (IMC) |
| url | https://www.mdpi.com/1996-1944/12/6/936 |
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