Comparison of composition of ultra-thin silicon oxynitride layers’ fabricated by PECVD and ultrashallow rf plasma ion implantation

In this paper differences in chemical composition of ultra-thin silicon oxynitride layers fabricated in planar rf plasma reactor are studied. The ultra-thin dielectric layers were obtained in the same reactor by two different methods: ultrashallow nitrogen implantation followed by plasma oxidation...

Full description

Bibliographic Details
Main Authors: Robert Mroczyński, Tomasz Bieniek, Romuald B. Beck, Michał Ćwil, Piotr Konarski, Patrick Hoffmann, Dieter Schmeißer
Format: Article
Language:English
Published: National Institute of Telecommunications 2023-06-01
Series:Journal of Telecommunications and Information Technology
Subjects:
Online Access:https://jtit.pl/jtit/article/view/822