Chemical metrology on latent resist images

Patterning photoresist with extreme control over dose and placement is the first crucial step in semiconductor manufacturing. However, how can the activation of modern complex resist components be accurately measured at sufficient spatial resolution? No exposed nanometre-scale resist pattern is suff...

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Main Authors: Maarten van Es, Selman Tamer, Elin Bloem, Laurent Fillinger, Elfi van Zeijl, Klára Maturová, Jacques van der Donck, Rob Willekers, Adam Chuang, Diederik Maas
Format: Article
Language:English
Published: Elsevier 2023-06-01
Series:Micro and Nano Engineering
Subjects:
Online Access:http://www.sciencedirect.com/science/article/pii/S2590007223000114
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author Maarten van Es
Selman Tamer
Elin Bloem
Laurent Fillinger
Elfi van Zeijl
Klára Maturová
Jacques van der Donck
Rob Willekers
Adam Chuang
Diederik Maas
author_facet Maarten van Es
Selman Tamer
Elin Bloem
Laurent Fillinger
Elfi van Zeijl
Klára Maturová
Jacques van der Donck
Rob Willekers
Adam Chuang
Diederik Maas
author_sort Maarten van Es
collection DOAJ
description Patterning photoresist with extreme control over dose and placement is the first crucial step in semiconductor manufacturing. However, how can the activation of modern complex resist components be accurately measured at sufficient spatial resolution? No exposed nanometre-scale resist pattern is sufficiently sturdy to unalteredly withstand inspection by intense photon or electron beams, not even after processing and development.This paper presents experimental proof that infrared atomic force microscopy (IR-AFM) is sufficiently sensitive and gentle to chemically record vulnerable yet valuable lithographic patterns in a chemically amplified resist after exposure prior to development. Accordingly, IR-AFM metrology provides long-sought insights into changes in the chemical and spatial distribution per component in a latent resist image, both directly after exposure and during processing. With these to-be-gained understandings, a disruptive acceleration of resist design and processing is expected.
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spelling doaj.art-0653850e95f944f287663f12ba7a92af2023-06-21T06:58:52ZengElsevierMicro and Nano Engineering2590-00722023-06-0119100181Chemical metrology on latent resist imagesMaarten van Es0Selman Tamer1Elin Bloem2Laurent Fillinger3Elfi van Zeijl4Klára Maturová5Jacques van der Donck6Rob Willekers7Adam Chuang8Diederik Maas9Corresponding author.; Netherlands Organisation for Applied Scientific Research (TNO), Delft, NetherlandsNetherlands Organisation for Applied Scientific Research (TNO), Delft, NetherlandsNetherlands Organisation for Applied Scientific Research (TNO), Delft, NetherlandsNetherlands Organisation for Applied Scientific Research (TNO), Delft, NetherlandsNetherlands Organisation for Applied Scientific Research (TNO), Delft, NetherlandsNetherlands Organisation for Applied Scientific Research (TNO), Delft, NetherlandsNetherlands Organisation for Applied Scientific Research (TNO), Delft, NetherlandsNetherlands Organisation for Applied Scientific Research (TNO), Delft, NetherlandsNetherlands Organisation for Applied Scientific Research (TNO), Delft, NetherlandsNetherlands Organisation for Applied Scientific Research (TNO), Delft, NetherlandsPatterning photoresist with extreme control over dose and placement is the first crucial step in semiconductor manufacturing. However, how can the activation of modern complex resist components be accurately measured at sufficient spatial resolution? No exposed nanometre-scale resist pattern is sufficiently sturdy to unalteredly withstand inspection by intense photon or electron beams, not even after processing and development.This paper presents experimental proof that infrared atomic force microscopy (IR-AFM) is sufficiently sensitive and gentle to chemically record vulnerable yet valuable lithographic patterns in a chemically amplified resist after exposure prior to development. Accordingly, IR-AFM metrology provides long-sought insights into changes in the chemical and spatial distribution per component in a latent resist image, both directly after exposure and during processing. With these to-be-gained understandings, a disruptive acceleration of resist design and processing is expected.http://www.sciencedirect.com/science/article/pii/S2590007223000114Scanning probe microscopyIR-AFMLatent imageMetrologyResist
spellingShingle Maarten van Es
Selman Tamer
Elin Bloem
Laurent Fillinger
Elfi van Zeijl
Klára Maturová
Jacques van der Donck
Rob Willekers
Adam Chuang
Diederik Maas
Chemical metrology on latent resist images
Micro and Nano Engineering
Scanning probe microscopy
IR-AFM
Latent image
Metrology
Resist
title Chemical metrology on latent resist images
title_full Chemical metrology on latent resist images
title_fullStr Chemical metrology on latent resist images
title_full_unstemmed Chemical metrology on latent resist images
title_short Chemical metrology on latent resist images
title_sort chemical metrology on latent resist images
topic Scanning probe microscopy
IR-AFM
Latent image
Metrology
Resist
url http://www.sciencedirect.com/science/article/pii/S2590007223000114
work_keys_str_mv AT maartenvanes chemicalmetrologyonlatentresistimages
AT selmantamer chemicalmetrologyonlatentresistimages
AT elinbloem chemicalmetrologyonlatentresistimages
AT laurentfillinger chemicalmetrologyonlatentresistimages
AT elfivanzeijl chemicalmetrologyonlatentresistimages
AT klaramaturova chemicalmetrologyonlatentresistimages
AT jacquesvanderdonck chemicalmetrologyonlatentresistimages
AT robwillekers chemicalmetrologyonlatentresistimages
AT adamchuang chemicalmetrologyonlatentresistimages
AT diederikmaas chemicalmetrologyonlatentresistimages