Simulation of TSV Protrusion in 3DIC Integration by Directly Loading on Coarse-Grained Phase-Field Crystal Model

Simulation of TSV Protrusion in 3DIC Integration by Directly Loading on Coarse-Grained Phase-Field Crystal Model

As thermal management in 3DIC integration becomes increasingly important in advanced semiconductor node processes, novel experimental and modeling approaches are in great demand to reveal the critical material issues involving multiscale microstructures that govern the behavior of through-silicon-vi...

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Bibliographic Details
Main Authors: Xiaoting Luo, Zhiheng Huang, Shuanjin Wang, Min Xiao, Yuezhong Meng, Hui Yan, Qizhuo Li, Gang Wang
Format: Article
Language:English
Published: MDPI AG 2022-01-01
Series:Electronics
Subjects:
3DIC integration
through-silicon-via
protrusion
microstructure
amplitude expansion
phase-field crystal model
Online Access:https://www.mdpi.com/2079-9292/11/2/221

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https://www.mdpi.com/2079-9292/11/2/221

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