Stress concentration-relocating interposer in electronic textile packaging using thermoplastic elastic polyurethane film with via holes for bearing textile stretch

Abstract Electronic textile (e-textile) devices require mechanically reliable packaging that can bear up to 30% stretch induced by textile crimp stretch, because the boundary between the rigid electronic components and the soft fabric circuit in the e-textile is prone to rupture due to mismatch of t...

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Bibliographic Details
Main Authors: Seiichi Takamatsu, Suguru Sato, Toshihiro Itoh
Format: Article
Language:English
Published: Nature Portfolio 2022-06-01
Series:Scientific Reports
Online Access:https://doi.org/10.1038/s41598-022-13493-7